UMEC(HK) and HKSTP Co-host AI Chips Summit to Foster Industry Connections and Strategy Formulation
(Hong Kong – 5 December 2019) United Microelectronics Centre (Hong Kong) Limited and Hong Kong Science and Technology Park Corporation jointly hosted the AI Chips Summit at the Hong Kong Science Park. A number of global leading experts from academia and business are invited to share the latest technologies of AI chips, as well as to discuss the opportunities, challenges and strategies for the industry development. The summit attracted more than 200 academic researchers, industry practitioners, investors and entrepreneurs and had caused a sensation in the industry.
Dr. Mei Kei Ieong, CEO of United Microelectronics Centre (Hong Kong) Limited and Mr. Albert Wong, CEO of Hong Kong Science and Technology Parks Corporation gave opening remarks to kick off the summit. In the opening keynote, Dr. Walden C. Rhines, CEO of Emeritus, Mentor, a Siemens Business shared how new IC design approach enables AI revolutions from smart cities to health care and from transportation to robotics. Dr. Rhines pointed out that the success of heterogeneous integration is simplifying and speeding up package verification, while ensuring full coverage and accurate results in the 3D-IC session.
Fellow keynoters Prof. Deming Chen and Prof. Elyse Rosenbaum from the University of Illinois Urbana-Champaign (UIUC) respectively explained how heterogeneous hardware systems drive AI revolution, introduced the FPGA-based accelerators with low power consumption and high accuracy, and how to apply machine learning in chip, package and board design.
Prof. Evangeline Young from the Chinese University of Hong Kong shared how AI can improve the physical design of the chips in different levels. Dr. Hayden So from the University of Hong Kong explained how efficient reconfigurable hardware can be applied to AI. Prof. Chi Ying Tsui from the Hong Kong University of Science and Technology introduced the energy-efficient AI accelerator which applied to the edge devices. Last but not least, Mr. Nelson Fan, Vice President, APT Business Development of ASM Pacific Technology explored the opportunities and challenges brought by the integration of heterogeneous systems to the advanced 3D-IC packaging technology.
There are two panel discussion sessions during the summit, led by Prof. Philip Chan, Deputy President and Provost of The Hong Kong Polytechnic University and Dr. Mei Kei Ieong, CEO of United Microelectronics Centre (Hong Kong) Limited respectively. The panellists are pioneers from academia and business who specialise in design tools. Prof. Chan and the panellists discussed the development direction of the new electronic design automation (EDA) tools and the associated opportunities brought to the start-ups.
In accordance with the HKSAR Government’s policy that promotes “re-industrialisation”, Dr. Ieong and the panellists discussed the positioning of the microelectronics industry of Hong Kong and the necessary infrastructure to support the sustainable development. The panellists provided different insights, advices and thoughts of cross-domain collaboration and were looking forward to further actions in improving the industry development of AI chips and systems.
United Microelectronics Centre (Hong Kong) Limited also set up a booth, demonstrating the V2X AI Driver Assistance System and the AI chips and technologies applied to 3D TVs, as well as liaising and exploring cooperation opportunities with the summit participants.
Watch the highlight videos of the AI Chips Summit:
About United Microelectronics Centre (Hong Kong) Limited
United Microelectronics Centre (Hong Kong) Limited is a research and development company in Hong Kong, focusing on AI chips & systems and 5G applications development. We respond to the dynamic market environment by adopting an innovative research centre operation model, highlighted by talent-centric culture and tailored research projects. Through continuous cooperation with global top echelon universities and research institutions, we bring the AI and 5G technologies to the next level and drive commercialisation.
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